Full Range of PCB Capabilities to Fit Your PCB Manufacturing Needs

UETPCBA specializes in the prototype and production of high-end double-sided/ multi-layer circuit PCB circuit boards. PCB products include 1-48 layers board, HDI PCB, high TG thick copper PCB, high frequency PCB, Rogers mixed-lamination PCB, blind/buried vias PCB, metal base PCB, half hole PCB, gold-finger PCB, impedance control PCB, countersunk hole PCB, high frequency antenna PCB, etc. Our core competitiveness is leading PCB technology, high-end PCB capabilities production technology, high-quality PCB products, on-time delivery, consultant customer service and optimal cost.

In the field of high-end printed circuit board manufacturing, we always maintain efficient delivery capabilities, combined with the high quality of production management, research and development PCB manufacturing capabilities, manufacturing capabilities and construction of PCB core technologies, accelerating technological innovation and development.

Listed below are UETPCBA’s PCB manufacturing capabilities. We are focused on providing high-quality printed circuit boards to fit all of your needs.

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Detailed Printed Circuit Board Assembly Capabilities

Standard Features Standard Advanced
Maximum Layer Count 20 48
Maximum Panel Size 533x610mm [21×24″] 610x1067mm [24×42″]
Outer Layer Trace/Spacing 90µm/90µm 64µm/76µm
(1/3oz starting foil + platig) [0.0035″/0.0035″] [0.0025″/0.003″]
Inner Layer Trace/Spacing 76µm/76µm 50µm/50µm
(Hoz inner layer cu) [0.003″/0.003″] [0.002″/0.002″]
Maximum PCB Thickness 3.2mm [0.125″] 6.5mm [0.256″]
Minimum PCB Thickness .20mm [0.008″] .10mm [0.004″]
Minimum Mechancial Drill Size .20mm [0.008″] .10mm [0.004″]
Minimum Laser Drill Size .10mm [0.004″] .08mm [0.003″]
Maximum PCB Aspect Ratio 10:1 25:1
Maximum Copper Weight 5 oz [178µm] 6 oz [214µm]
Minimum Copper Weight 1/3 oz [12µm] 1/4 oz [9µm]
Minimum Core Thickness 50µm [0.002″] 38µm [0.0015″]
Minimum Dielectric Thickness 64µm [0.0025″] 38µm [0.0015″]
Minimum Pad Size Over Drill 0.46mm [0.018″] 0.4mm [0.016″]
Solder Mask Registration ± 50µm [0.002″] ± 38µm [0.0015″]
Minimum Solder Mask Dam 76µm [0.003″] 64µm [0.0025″]
Copper Feature to Edge, V‐cut (30°) 0.40mm [0.016″] 0.36mm [0.014″]
Copper Feature to PCB Edge, Routed 0.25mm [0.010″] 0.20mm [0.008″]
Tolerance on Overall ± 100µm [0.004″] ±50µm [0.002″]
HDI Features Standard Advanced
Minimum Microvia Hole Size 100µm [0.004″] 75µm [0.003″]
Capture Pad Size 0.25mm [0.010″] 0.20mm [0.008″]
Glass Reinforced Dielectrics Y Y
Maximum Aspect Ratio 0.7:1 1:1
Stacked Microvias Y Y
Copper Filled Microvias Y Y
Buried Filled Vias Y Y
Maximum No. of Buildup Layers 3+N+3 5+N+5

PCB Materials

FR4 Standard Tg Shengyi, ITEQ, KB, Nanya
FR4 Mid Tg Shengyi S1000, ITEQ IT158
FR4 High Tg Shengyi S1000‐2, S1170
Isola 370HR
Panasonic R1755V
High Performance EMC EM828, EM888(S), EM888(K)
Isola FR408, FR408HR
Isola I‐Speed, I‐Tera MT
Nelco N4000‐13EP, EPSI
Panasonic R5775 Megtron 6
RF Materials Rogers RO4350, RO3010
Taconic RF‐30, RF‐35, TLC, TLX, TLY
Taconic 601, 602, 603, 605
Halogen Free EMC EM285, EM370(D)
Panasonic R1566
Aluminum Backed PCB Shengyi SAR20, Yugu YGA

Surface Finishes

Electroless Nickel Immersion Gold (ENIG)
Hot Air Solder Level (HASL, Lead and Lead‐free)
OSP, Immersion Tin,Immersion Silver, ENEPIG
Gold Fingers, Flash Gold, Full Body Hard Gold, Wire Bondable Gold
Selective and Multiple Surface Finishes
Carbon Ink, Peelable SM