Quality Management

Under the guidance of ISO9001 quality system, IPC-A-610E standard and SPC control method to improve quality system and fabrication equipment. We strictly control PCB design process, DFM checking, new product introduction, PCBA manufacturing, supply chain management, PCBA testing and personnel training to form a quality management system to ensure the stability of the production process and quality assurance.

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Pre-production Check:

Confirm final file version

Confirm PCB specifications: material, thickness, copper thickness, layers, stack-up, finish surface, solder mask and so on.

Correct designators of components and clear silkscreen with orientation

Complete component descriptions of manufacturer, P/N, designator and QTY in BOM

Correct pick & place file

SMT Process: with lead/lead-free

Complete procedure of programming and function test

Other special requirements

New Product Introduction:

Hold a new product introduction meeting with sales, engineering, production, purchasing and quality department.

Make clear customer’s requirements, product application, lead time and other special technical requirements

Record into production system and generate Internal & customer PN

Evaluation of manufacturing difficulty and key quality control points of the project

Clear Lead time of PCB fabrication, PCB assembly and components procurement

Make production & test plan 

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PCB Manufacturing:

High quality raw material guarantee

High-end manufacturing capabilities

Advanced production & test equipment

Professional technical team

All PCB 100% electrical test

Components Procurement:

100% original parts as specified follow customer’s BOM

Purchase from original manufacturer, authorized distributor and other formal channels

Provide perfect original technical support & COC

Shorter procurement cycle, stock advantages

Provide cost down solutions in long term

Incoming Material Quality Control:

PCB checking: measurement of PCB Thickness, through hole if non-plated or covered with solder mask, Pads if flat and clean, silkscreen if clear, if PCB warped, scraped and broken

Check the PN, QTY and silkscreen of incoming components if they are consistent with BOM

The incoming components are placed on the bare board for the fit test

Check the value of resistors and capacitors and compare them with BOM

Check whether there are scratches, deformations, broken pins, short pins on the surface of incoming components.

Component Storage & Solder Paste Printing:

Professional constant temperature and humidity cabinet to save sensitive components

Bake the PCB/IC/BGA for 2-12 hours to remove the moisture on the surface and enhance the solderability

Select high-quality manufacturers of solder paste, such as Alpha-fry

Free provide high quality laser SMD stencil

Equipped automatic solder paste printer and SPI to ensure consistency and reliability

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SMT Assembly:

Yamaha and FUJI high speed automatic SMT pick* place machine, up to 01005

Major chip types such as QFN, SOP, SOT, TSOP, QFP, BGA, PLCC are available

Automatic optical inspection (AOI) to detect wrong & missing parts, reverse

& false soldering and other defects

X -Ray inspection to check soldering effects of balls

All PCBA boards will be 100% test


(I)PCB bare boards: UETPCBA provide warrants for bare PCB boards against defects in materials and workmanship under normal use for a period of 90 days from date of shipment. If a defect arises and a valid claim is received within the warranty period, return the bare boards. UETPCBA provide two solutions: re-fabricate the bare board at no charge or issue a credit equal to the original order price.

UETPCBA will not accept liability for any cost in addition to the value of the bare boards including but not limited to components, labor, business interruptions and any other consequential damages or losses.

(II)PCBA boards: We will include the cost of any components UETPCBA supplied and all labor that we supplied with regard to replacing the assemblies or issuing a credit.

 This limited warranty does not apply:

(A) Damage caused by use with non-UETPCBA products and services;

(B) Damage caused by accident, abuse, misuse, flood, fire, earthquake or other external causes;

(C) Product or component that has been modified to alter functionality or capability without the written permission of UETPCBA;

(D) Appearance damage, including but not limited to scratches or dents, does not affect the product’s functionality or materially impair its use.