Our Full Range of PCB Assembly Capabilities Can Offer Responsive Flexibility to Customer’s PCBA requirements

UETPCBA has developed 15 years of assembly experience to offer responsive flexibility to customer’s requirements of printed circuit board assembly. Our Printed Circuits Boards Assembly Capability includes full turn-key, partial turn-key and Kitted/Consigned assembly, whether you supply the parts or parts provided by us, our professional assembly technicians and advanced equipment can build your PCBA products with high-quality.

Our PCB assembly capabilities range from single layer to 48layers PCBAs with basic thru-hole components soldering or different SMD packages in LGA, BGA, PQFN, and 01005 size. Our assembly capabilities include but are not limited to what are listed below. For more detailed PCB Assembly capabilities, please contact us directly.

PCBA Capabilities

SMTPCBMaximum PCB size1200*600mm
Maximum PCB weight8kg
PCB typesRigid, flex ,rigid-flex PCB
PCB thickness0.3mm–6mm
Solder paste printing precision±25μm
SPIminimum inspection spacing of solder ball100μm
X-Y precision0.5μm
AssemblyDimensions of components0.3*0.15 mm²–200*125 mm²
Maximum height of components25.4mm
Maximum weight of components100g
BGA/CSP Minimum ball spacing, ball diameter0.30mm,0.15mm
Assembly precision±22μm,±0.05°
Maximum type of material components500
ReflowTemperature precision±1℃
Soldering protectionnitrogen protection
Nitrogen control±200ppm
AXIMinimum components1005
Minimum pin spacing0.4mm(QFP)
Minimum solder thickness0.0127mm
DIPDipPlug-in technologyAutomatic insert parts machine
Wave solderingWave typecommon wave、Selective wave
Conveyor path gradient4–7°
common wave soldering precision±3℃
Selecting wave stability precision±0.06 mm
Soldering protectionnitrogen protection
Coating technologyMaximum size500*475*6mm³
Maximum weight5kg
Minimum nozzle diameter2mm
TestAOIminimum package1005
Inspection contentwrong parts、missing parts、wrong polarity、misalignment、tombstone、 solder short、solder bridge、cold solder
X-RayMagnificationGeometric magnification 2000;System magnification 12000
Resolution1μm /nm
Rotation angle&Tilt Angleany ±45°+360°
In-Circuit Test (ICT)Number of test points>4096
Test contentContact test、Open-short circuit test、CR test、No power mixed test、Boundary scan testing、Power on mixed test
Functional testTest contentCheck the functionalityand performance of the PCBA
IC programmingTransfer the program into the internal storage space of the chip
First Article Inspection (FAI )Checking the first PCBA sample soldering before production run
Other reliability testsAging Test, Life Cycle Test,Vibration Test,Surge Test,Packaging Test,Button Life Test
TurnkeyAssembly TypesSurface Mount Technology(SMT) Assembly,Through-Hole Assembly,Mixed Assembly,BGA Assembly
Box bulid AssemblyCustom Plastic & Metal Casings, Complete box build for a variety of applications
Other servicesConformal Coating,Custom Packaging,Custom Label & barcode,Aftermarket Service andRepair

Start A Quote Now