SMT | PCB | Maximum PCB size | 1200*600mm |
Maximum PCB weight | 8kg |
PCB types | Rigid, flex ,rigid-flex PCB |
PCB thickness | 0.3mm–6mm |
Solder paste printing precision | ±25μm |
SPI | minimum inspection spacing of solder ball | 100μm |
X-Y precision | 0.5μm |
Assembly | Dimensions of components | 0.3*0.15 mm²–200*125 mm² |
Maximum height of components | 25.4mm |
Maximum weight of components | 100g |
BGA/CSP Minimum ball spacing, ball diameter | 0.30mm,0.15mm |
Assembly precision | ±22μm,±0.05° |
Maximum type of material components | 500 |
Reflow | Temperature precision | ±1℃ |
Soldering protection | nitrogen protection |
Nitrogen control | ±200ppm |
AXI | Minimum components | 1005 |
Minimum pin spacing | 0.4mm(QFP) |
Minimum solder thickness | 0.0127mm |
DIP | Dip | Plug-in technology | Automatic insert parts machine |
Wave soldering | Wave type | common wave、Selective wave |
Conveyor path gradient | 4–7° |
common wave soldering precision | ±3℃ |
Selecting wave stability precision | ±0.06 mm |
Soldering protection | nitrogen protection |
Coating technology | Maximum size | 500*475*6mm³ |
Maximum weight | 5kg |
Minimum nozzle diameter | 2mm |
Test | AOI | minimum package | 1005 |
Inspection content | wrong parts、missing parts、wrong polarity、misalignment、tombstone、 solder short、solder bridge、cold solder |
X-Ray | Magnification | Geometric magnification 2000;System magnification 12000 |
Resolution | 1μm /nm |
Rotation angle&Tilt Angle | any ±45°+360° |
In-Circuit Test (ICT) | Number of test points | >4096 |
Test content | Contact test、Open-short circuit test、CR test、No power mixed test、Boundary scan testing、Power on mixed test |
Functional test | Test content | Check the functionalityand performance of the PCBA |
IC programming | Transfer the program into the internal storage space of the chip |
First Article Inspection (FAI ) | Checking the first PCBA sample soldering before production run |
Other reliability tests | Aging Test, Life Cycle Test,Vibration Test,Surge Test,Packaging Test,Button Life Test |
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Turnkey | Assembly Types | Surface Mount Technology(SMT) Assembly,Through-Hole Assembly,Mixed Assembly,BGA Assembly |
Box bulid Assembly | Custom Plastic & Metal Casings, Complete box build for a variety of applications |
Other services | Conformal Coating,Custom Packaging,Custom Label & barcode,Aftermarket Service andRepair |
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