| SMT | PCB | Maximum PCB size | 1200*600mm |
| Maximum PCB weight | 8kg |
| PCB types | Rigid, flex ,rigid-flex PCB |
| PCB thickness | 0.3mm–6mm |
| Solder paste printing precision | ±25μm |
| SPI | minimum inspection spacing of solder ball | 100μm |
| X-Y precision | 0.5μm |
| Assembly | Dimensions of components | 0.3*0.15 mm²–200*125 mm² |
| Maximum height of components | 25.4mm |
| Maximum weight of components | 100g |
| BGA/CSP Minimum ball spacing, ball diameter | 0.30mm，0.15mm |
| Assembly precision | ±22μm，±0.05° |
| Maximum type of material components | 500 |
| Reflow | Temperature precision | ±1℃ |
| Soldering protection | nitrogen protection |
| Nitrogen control | ±200ppm |
| AXI | Minimum components | 1005 |
| Minimum pin spacing | 0.4mm（QFP） |
| Minimum solder thickness | 0.0127mm |
| DIP | Dip | Plug-in technology | Automatic insert parts machine |
| Wave soldering | Wave type | common wave、Selective wave |
| Conveyor path gradient | 4–7° |
| common wave soldering precision | ±3℃ |
| Selecting wave stability precision | ±0.06 mm |
| Soldering protection | nitrogen protection |
| Coating technology | Maximum size | 500*475*6mm³ |
| Maximum weight | 5kg |
| Minimum nozzle diameter | 2mm |
| Test | AOI | minimum package | 1005 |
| Inspection content | wrong parts、missing parts、wrong polarity、misalignment、tombstone、 solder short、solder bridge、cold solder |
| X-Ray | Magnification | Geometric magnification 2000；System magnification 12000 |
| Resolution | 1μm /nm |
| Rotation angle&Tilt Angle | any ±45°+360° |
| In-Circuit Test (ICT） | Number of test points | ＞4096 |
| Test content | Contact test、Open-short circuit test、CR test、No power mixed test、Boundary scan testing、Power on mixed test |
| Functional test | Test content | Check the functionalityand performance of the PCBA |
| IC programming | Transfer the program into the internal storage space of the chip |
| First Article Inspection (FAI ) | Checking the first PCBA sample soldering before production run |
| Other reliability tests | Aging Test, Life Cycle Test，Vibration Test，Surge Test，Packaging Test，Button Life Test |
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| Turnkey | Assembly Types | Surface Mount Technology(SMT) Assembly,Through-Hole Assembly,Mixed Assembly,BGA Assembly |
| Box bulid Assembly | Custom Plastic & Metal Casings, Complete box build for a variety of applications |
| Other services | Conformal Coating，Custom Packaging，Custom Label & barcode，Aftermarket Service andRepair |
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