| SMT |
PCB |
Maximum PCB size |
1200*600mm |
| Maximum PCB weight |
8kg |
| PCB types |
Rigid, flex ,rigid-flex PCB |
| PCB thickness |
0.3mm–6mm |
| Solder paste printing precision |
±25μm |
| SPI |
minimum inspection spacing of solder ball |
100μm |
| X-Y precision |
0.5μm |
| Assembly |
Dimensions of components |
0.3*0.15 mm²–200*125 mm² |
| Maximum height of components |
25.4mm |
| Maximum weight of components |
100g |
| BGA/CSP Minimum ball spacing, ball diameter |
0.30mm，0.15mm |
| Assembly precision |
±22μm，±0.05° |
| Maximum type of material components |
500 |
| Reflow |
Temperature precision |
±1℃ |
| Soldering protection |
nitrogen protection |
| Nitrogen control |
±200ppm |
| AXI |
Minimum components |
1005 |
| Minimum pin spacing |
0.4mm（QFP） |
| Minimum solder thickness |
0.0127mm |
| DIP |
Dip |
Plug-in technology |
Automatic insert parts machine |
| Wave soldering |
Wave type |
common wave、Selective wave |
| Conveyor path gradient |
4–7° |
| common wave soldering precision |
±3℃ |
| Selecting wave stability precision |
±0.06 mm |
| Soldering protection |
nitrogen protection |
| Coating technology |
Maximum size |
500*475*6mm³ |
| Maximum weight |
5kg |
| Minimum nozzle diameter |
2mm |
| Test |
AOI |
minimum package |
1005 |
| Inspection content |
wrong parts、missing parts、wrong polarity、misalignment、tombstone、 solder short、solder bridge、cold solder |
| X-Ray |
Magnification |
Geometric magnification 2000；System magnification 12000 |
| Resolution |
1μm /nm |
| Rotation angle&Tilt Angle |
any ±45°+360° |
| In-Circuit Test (ICT） |
Number of test points |
＞4096 |
| Test content |
Contact test、Open-short circuit test、CR test、No power mixed test、Boundary scan testing、Power on mixed test |
| Functional test |
Test content |
Check the functionalityand performance of the PCBA |
| IC programming |
Transfer the program into the internal storage space of the chip |
| First Article Inspection (FAI ) |
Checking the first PCBA sample soldering before production run |
| Other reliability tests |
Aging Test, Life Cycle Test，Vibration Test，Surge Test，Packaging Test，Button Life Test |
|
| Turnkey |
Assembly Types |
Surface Mount Technology(SMT) Assembly,Through-Hole Assembly,Mixed Assembly,BGA Assembly |
| Box bulid Assembly |
Custom Plastic & Metal Casings, Complete box build for a variety of applications |
| Other services |
Conformal Coating，Custom Packaging，Custom Label & barcode，Aftermarket Service andRepair |
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